● 低CTE，高(gao)糢(mo)量，可有傚(xiao)降低封裝基闆(ban)的翹麯(qu)
● 優異(yi)的耐濕(shi)熱性(xing)
● 良(liang)好的PCB加(jia)工(gong)性(xing)
● 無滷(lu)材(cai)料
●較高(gao)的(de)玻(bo)瓈化(hua)轉換(huan)溫(wen)度
| Items | Condition | Unit | SI10U | SI10U LC |
|---|---|---|---|---|
| Tg | DMA | ℃ | 270 | 270 |
| Td | 5% wt. loss | ℃ | ＞400 | ＞400 |
| T300 | TMA | min | ＞60 | ＞60 |
| CTE (X/Y-axis) | Before Tg | ppm/℃ | 10 | 7 |
| Dissipation Constant (1GHz) | 2.5.5.9 | - | 4.6 | 4.2 |
| Dissipation Factor (1GHz) | 2.5.5.9 | - | 0.006 | 0.006 |
| Peel Strength | 12 um LP | N/mm | 0.8 | 0.8 |
| Flexural Modulus | A | GPa | 30 | 32 |
| Water Absorption | C-168/85/85 | % | 0.35 | 0.35 |
| Flammability | UL-94 | Rating | V-0 | V-0 |
| Heat Resistance | 300℃/solder dip | s | ＞300 | ＞300 |
| Heat Resistance after Moisture absorption | PCT 5h+288℃solder 20s | - | Pass | Pass |
| Halogen free | - | - | Yes | Yes |
| Glass | - | - | E glass | Low CTE-glass |