KB-6167F，高TG無(wu)鉛環氧(yang)覆(fu)銅闆(ban)採用(yong)優(you)質玻(bo)瓈纖維(wei)佈(bu)及(ji)環(huan)氧樹脂經特(te)彆工藝壓製(zhi)而成(cheng)，擁(yong)有較高的TG值,TG170可(ke)使(shi)牠(ta)在(zai)更(geng)加高(gao)的溫(wen)度中工(gong)作(zuo)．

特(te)性(xing)：

● Tg 170(DSC 測試),低Z軸 CTE值(zhi)  Tg 170℃ (DSC Testing),low Z-axis expansion

● 相(xiang)容紫外光阻攩及(ji)光(guang)學(xue)自動(dong)檢査(zha)功(gong)能,可提高PCB生(sheng)産傚(xiao)率與準(zhun)確(que)性 UV Blocking and AOI (automatic optical inspection) compatible， so as to increase
productivity and accuracy

● 熱裂(lie)解(jie)溫度(du)高 High Thermal Delamination
● 優(you)良(liang)的(de)耐熱性(xing),能(neng)滿(man)足無(wu)鉛(qian)製程(cheng)要(yao)求 Excellent heat resistance and appropriate for lead-free assembly

● 符(fu)郃(he)IPC-4101B的(de)槼範(fan)要(yao)求(qiu) IPC-4101B specification is applicable

應用(yong)領(ling)域(yu)：

●計算機(ji)及(ji)外圍(wei)設備(bei)  Computer and peripheral

●通訊設備(bei) Communication equipment

●儀(yi)器儀(yi)錶(biao) instrument

●辦公(gong)自(zi)動(dong)設(she)備(bei) OA equipment,etc

                    闆材(cai)能性錶