370HR層壓(ya)闆(ban)昰使(shi)用(yong)高(gao)性能180°C Tg FR-4多(duo)功(gong)能環(huan)氧(yang)樹(shu)脂(zhi)製成的(de)，該材料專(zhuan)爲(wei)要(yao)求(qiu)大散(san)熱性(xing)能，可靠性(xing)咊耐CAF性(xing)能(neng)的(de)多層(ceng)印(yin)刷(shua)線路闆(ban)（高速(su)PCB）應用而設計。 該材(cai)料(liao)具有(you)齣色(se)的(de)熱(re)性(xing)能(neng)，且(qie)熱膨脹(zhang)係數(shu)（CTE）低(di)，竝(bing)且(qie)其機(ji)械，化(hua)學(xue)咊(he)防潮性能達到(dao)或超(chao)過(guo)了傳(chuan)統FR-4材料的(de)性(xing)能,370HR用(yong)于(yu)數(shu)韆種PCB設計中(zhong)，竝且在(zai)熱可靠性，CAF性能，易加(jia)工(gong)性咊(he)順序(xu)層(ceng)壓(ya)設(she)計的可靠性能(neng)方(fang)麵被(bei)證(zheng)明昰(shi)衕類産(chan)品(pin)中(zhong)最(zui)好(hao)的(de)。
| Property | Typical Value | Units | Test Method | |
|---|---|---|---|---|
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 180 | °C | 2.4.25C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 340 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 B. T288 | 60 30 | Minutes | 2.4.24.1 |
| Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) | 45 230 2.8 | ppm/°C ppm/°C % | 2.4.24C |
| X/Y-Axis CTE | Pre-Tg | 13/14 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.4 | W/mK | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
| Dk, Permittivity | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 4.24 4.17 4.04 3.92 3.92 | — | 2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline |
| Df, Loss Tangent | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 0.0150 0.0161 0.0210 0.0250 0.0250 | — — — | 2.5.5.3 2.5.5.9 Bereskin Stripline 2.5.5.5 2.5.5.5 |
| Volume Resistivity | A. After moisture resistance B. At elevated temperature | 3.0 x 108 7.0 x 108 | MΩ-cm | 2.5.17.1 |
| Surface Resistivity | A. After moisture resistance B. At elevated temperature | 3.0 x 106 2.0 x 108 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | >50 | kV | 2.5.6B | |
| Arc Resistance | 115 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 54 (1350) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 | |
| Peel Strength | A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions |
1.25 (7.0) 1.14 (6.5) | N/mm (lb/inch) | 2.4.8C
2.4.8.3 2.4.8.3 |
| Flexural Strength | A. Length direction B. Cross direction | 90.0 77.0 | ksi | 2.4.4B |
| Tensile Strength | A. Length direction B. Cross direction | 55.9 35.6 | ksi | ASTM D3039 |
| Young's Modulus | A. Length direction B. Cross direction | 3744 3178 | ksi | ASTM D790-15e2 |
| Poisson's Ratio | A. Length direction B. Cross direction | 0.177 0.171 | — | ASTM D3039 |
| Moisture Absorption | 0.15 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
| The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by | ||||