FR408HR層(ceng)壓(ya)闆昰(shi)採(cai)用高(gao)性(xing)能(neng)多功(gong)能樹(shu)脂咊電氣級（E-玻(bo)瓈(li)）玻(bo)瓈(li)纖維織(zhi)物加(jia)固壓(ya)製(zhi)而(er)成(cheng)。該(gai)材料在Z軸(zhou)擴展方麵(mian)提高了(le)30%，竝且(qie)提(ti)供(gong)了(le)比(bi)該領(ling)域(yu)競(jing)爭(zheng)産品多25%的(de)電(dian)帶(dai)寬(kuan)（更(geng)低(di)的(de)損(sun)耗(hao)）。這(zhe)些特性(xing)加上在迴(hui)流(liu)銲(han)時優越的(de)防潮(chao)性，使(shi)得産品能(neng)夠從熱(re)咊(he)電(dian)的(de)角度來提高(gao)闆(ban)的(de)優(you)質性(xing)。
| Property | Typical Value | Units | Test Method | |
|---|---|---|---|---|
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 190 | °C | 2.4.25C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 B. T288 | 60 >30 | Minutes | 2.4.24.1 |
| Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) | 55 230 2.8 | ppm/°C ppm/°C % | 2.4.24C |
| X/Y-Axis CTE | Pre-Tg | 16 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.4 | W/mK | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
| Dk, Permittivity | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 3.72 3.69 3.68 3.64 3.65 | — | 2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline |
| Df, Loss Tangent | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 0.0072 0.0091 0.0092 0.0098 0.0095 | — | 2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline |
| Volume Resistivity | A. After moisture resistance B. At elevated temperature | 4.4 x 107 9.4 x 107 | MΩ-cm | 2.5.17.1 |
| Surface Resistivity | A. After moisture resistance B. At elevated temperature | 2.6 x 106 2.1 x 108 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | >50 | kV | 2.5.6B | |
| Arc Resistance | 137 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 70 (1741) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 | |
| Peel Strength | A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. After process solutions |
0.90 (5.1) | N/mm (lb/inch) | 2.4.8C
2.4.8.3 |
| Flexural Strength | A. Length direction B. Cross direction | 72.5 58.0 | ksi | 2.4.4B |
| Tensile Strength | A. Length direction B. Cross direction | 54.5 38.7 | ksi | ASTM D3039 |
| Young's Modulus | A. Length direction B. Cross direction | 3695 3315 | ksi | ASTM D790-15e2 |
| Poisson's Ratio | A. Length direction B. Cross direction | 0.137 0.133 | — | ASTM D3039 |
| Moisture Absorption | 0.061 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
| The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by | ||||